研究方向:Mechanics of materials、Carbon neutrality/CCS/DAC、Smart green manufacturing/synthesis、Physics-based machine learning in materials design、Sustainable materials、Reaction and diffusion at interface
研究方向:Flexible devices and electronics、Microelectromechanical systems (MEMS)、Optical fibers and light-emitting diode (LED) packaging、Robotics、Semiconductor materials and device processing
研究方向:Optical wireless physical layer circuits and systems、High-speed wireline communication system-on-chip (SoC)、Millimeter-wave communication and sensing circuits、Indoor positioning and image processing technologies for robotic applications、Edge computing accelerator design for IoT applications